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1.27x2.54mm box header H5.5 straight solder
Product Name : 1.27x2.54mm box header H5.5 straight solder
Product ID : YS3236SX
Pitch : 2.54mm 2.0mm 1.27mm ; 1.0mm
Contact material : copper phosphor; copper
Plating : gold plated; tin plated
Type of terminal : SMT DIP RA
Insulator material : LCP PBT PA46 PA6T PA9T
Directions
Product Information
| Pitch | 1.27*2.54mm |
| Insulator height | H5.5mm; H10.5mm |
| Number of pin per row | 10~100pin |
| Insulator material | LCP PBT PA46 PA6T PA9T |
| Insulator Flammability | UL 94V-0 |
| Contact material | copper phosphor; copper |
| Plating | gold plated; tin plated |
| Type or terminal | SMT RA DIP |
| Color | grey;black; white |
| Package method | Bag package;Tube package;pallet package;tape&reel package |
| Climatic category | 55/125/21 |
| Operating temp. | -55...+125℃ |
Product Specification
Rated Current:1.0AMP
Contact Resistance: 20Ω Max
Withstand Voltage: 500V AC/DC
Insulation resistance: 1000mΩ Min
Operation Temperature: 40C to +105C
Contact Material: Brass
Contact Plating: Au Over Ni
Insulator Material: Polyester(UL94V-0)
Standard: PA6T
Max. Processing Temp: 230C for 30-60 Seconds
(260C for 10 Seconds)
Product Drawing
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