Welcome (log in) | Your Account
English

SHENZHEN YOSO CONNECTOR ELECTRONICS CO., LIMITED

Contact Us

 

 

Tel:86 (755) 6125 6514

Fax:86 (755) 2607 2541

Mobile :+86 188 9836 8729

E-mail:[email protected]

Web:www.yosoint.com

skype:+8618898368729( Daisy)

            +8615818641548(Steve)

Add:11B two line Liaokeng Road Shiyan Town Baoan District Shenzhen City 518108 Guangdong provice China 

 

 

Industry News

The development of the electronic connector features

2005/07/08

Connector development presents the following characteristics: high speed signal transmission and digital and integration of all kinds of signal transmission, the

miniaturization of product volume miniaturization and so on.

Connector contains range is very wide, covers communications, consumer electronics, aerospace, power, microelectronics, automotive, medical, instrumentation and other industries.In terms of communication industry, the connector is the development trend of high speed, high density, low crosstalk, low impedance, zero delay, etc.

On the market at present the mainstream of connector supports 6.25 Gbps transmission rate, but within two years, the market leading communication equipment manufactured products, research and development more than 10 Gbps it puts forward higher requirements on the connector.Again, the connector market mainstream density is 63 per inch of the differential signal, will soon be developed to 70 or even 80 per inch of the differential signal.

The impedance of the connector at present is 100 ohms, but will be replaced by the product of 85 ohms.For this type of connector, is currently the biggest technical difficulties under the high speed transmission and ensure that very low crosstalk.

In terms of consumer electronics, due to the increasing miniaturization of the machine, the requirement of the connector is also increasingly miniaturization.The market mainstream FPC connector spacing is 0.3 or 0.5 mm, 0.2 mm spacing of products have been popular this year.The biggest technical difficulties in miniaturization under the premise of guarantee the reliability of the product.